HV 223 Heat Sink Compound

APPLICATIONS

The material may be applied by brushing, spraying, or dabbing the product on the surface to be lubricated or sealed thickness. Excess material can be easily wiped away with a dry cloth or non – polar solvents.

SKU:medical kit-1-1-1-1-1-3-1Categories: , Tags:

Description:

ESSRBOND 223 is a heat transfer compound which is formulated with polydimethyl siloxane fluids in combination with metal oxides to provide superior thermal conductivity. It is designed to be used as a heat transfer paste in the electric and electronics industries.

FEATURES

  • Good Thermal conductivity
  • High Dielectric Constant
  • High dissipation factor
  • Good Insulation
  • Stable at high temperatures
  • Easy to apply
  • Non drying
  • Non-Toxic
  • Noncorrosive
PROPERTIES
RESULT
UNIT
Density at 30 ± 2°C
2.0 ± 0.3
g/cc
Weight loss at 200 ± 5°C
> 5.0
%
Viscosity at 30°C
55000 – 80000
cP
Thermal Conductivity
0.75
W/ m·k
Insulation Strength°C
> 4.5
in² / w
Dielectric Constant @100Hz
4.6
kV / mm
Application Temperature
10 to 40
°C
Service Temperature
-50 to +200
°C
Short Exposure
270
°C

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