Essrbond 223 Heat Sink Compound

ESSRBOND HV 23 HEAT SINK COMPOUND

Description:

ESSRBOND 223 is a heat transfer compound which is formulated with polydimethyl siloxane fluids in combination with metal oxides to provide superior thermal conductivity. It is designed to be used as a heat transfer paste in the electric and electronics industries.

Features:

1. Good Thermal conductivity
2. High Dielectric Constant
3. High dissipation factor
4. Good Insulation
5. Stable at high temperatures
6. Easy to apply
7. Non drying
8. Non-Toxic
9. Noncorrosive

Applications: 

The material may be applied by brushing, spraying, or dabbing the product on the surface to be lubricated or sealed thickness. Excess material can be easily wiped away with a dry cloth or non – polar solvents.

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