HV 223 Heat Sink Compound
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HV 223 Heat Sink Compound
Description:
ESSRBOND 223 is a heat transfer compound which is formulated with polydimethyl siloxane fluids in combination with metal oxides to provide superior thermal conductivity. It is designed to be used as a heat transfer paste in the electric and electronics industries.
FEATURES
- Good Thermal conductivity
- High Dielectric Constant
- High dissipation factor
- Good Insulation
- Stable at high temperatures
- Easy to apply
- Non drying
- Non-Toxic
- Noncorrosive
| PROPERTIES | RESULT | UNIT |
| Density at 30 ± 2°C | 2.0 ± 0.3 | g/cc |
| Weight loss at 200 ± 5°C | > 5.0 | % |
| Viscosity at 30°C | 55000 – 80000 | cP |
| Thermal Conductivity | 0.75 | W/ m-k |
| Insulation Strength°C | > 4.5 | in² / w |
| Dielectric Constant @100Hz | 4.6 | kV / mm |
| Application Temperature | 10 to 40 | °C |
| Service Temperature | -50 to + 200 | °C |
| Short Exposure | 270 | °C |
DOWNLOAD TECHNICAL DATA SHEET
APPLICATIONS
The material may be applied by brushing, spraying, or dabbing the product on the surface to be lubricated or sealed thickness. Excess material can be easily wiped away with a dry cloth or non – polar solvents.
CGSEAL SI 255 Potting Silicone Compound
November 5, 2024
